Recent advances in polymer-based electronic packaging materials

Authors

Keywords

Flip-chip underfill, Thermal interface material, Dielectric material, EMI shielding material

Journal

COMPOSITES COMMUNICATIONS

Volume 19, Issue -, Pages 154-167

Publisher

Elsevier BV

Online

2020-03-21

DOI

10.1016/j.coco.2020.03.011

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