Recent advances in polymer-based electronic packaging materials

标题

作者

关键词

Flip-chip underfill, Thermal interface material, Dielectric material, EMI shielding material

出版物

Volume 19, Issue -, Pages 154-167

出版商

Elsevier BV

发表日期

2020-03-21

DOI

10.1016/j.coco.2020.03.011

联系作者

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now