Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network
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Title
Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network
Authors
Keywords
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Journal
Materials Research Express
Volume 7, Issue 6, Pages 065308
Publisher
IOP Publishing
Online
2020-06-06
DOI
10.1088/2053-1591/ab99e8
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