Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

标题
Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network
作者
关键词
-
出版物
Materials Research Express
Volume 7, Issue 6, Pages 065308
出版商
IOP Publishing
发表日期
2020-06-06
DOI
10.1088/2053-1591/ab99e8

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