Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding

Published 2020 View Full Article

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Title
Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding
Authors
Keywords
Isothermal compression bonding, Dynamic recrystallization, Microstructures, Grain boundary, Misorientation
Journal
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 46, Issue -, Pages 1-11
Publisher
Elsevier BV
Online
2020-01-17
DOI
10.1016/j.jmst.2019.11.015

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