Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding

出版年份 2020 全文链接

标题

作者

关键词

Isothermal compression bonding, Dynamic recrystallization, Microstructures, Grain boundary, Misorientation

出版物

Volume 46, Issue -, Pages 1-11

出版商

Elsevier BV

发表日期

2020-01-17

DOI

10.1016/j.jmst.2019.11.015

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