Intercalation of copper microparticles in an expanded graphite film with improved through-plane thermal conductivity
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Title
Intercalation of copper microparticles in an expanded graphite film with improved through-plane thermal conductivity
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE
Volume 55, Issue 17, Pages 7351-7358
Publisher
Springer Science and Business Media LLC
Online
2020-03-13
DOI
10.1007/s10853-020-04533-6
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