Intercalation of copper microparticles in an expanded graphite film with improved through-plane thermal conductivity
出版年份 2020 全文链接
标题
Intercalation of copper microparticles in an expanded graphite film with improved through-plane thermal conductivity
作者
关键词
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出版物
JOURNAL OF MATERIALS SCIENCE
Volume 55, Issue 17, Pages 7351-7358
出版商
Springer Science and Business Media LLC
发表日期
2020-03-13
DOI
10.1007/s10853-020-04533-6
参考文献
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