Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics

标题
Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics
作者
关键词
Molecular dynamics, Silicon carbide, Silicon dioxide, Wear regime, Sliding, Rolling
出版物
CERAMICS INTERNATIONAL
Volume -, Issue -, Pages -
出版商
Elsevier BV
发表日期
2020-05-31
DOI
10.1016/j.ceramint.2020.05.263

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