Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Published 2019 View Full Article

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Title
Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers
Authors
Keywords
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Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 9, Issue 11, Pages 2152-2159
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2019-10-02
DOI
10.1109/tcpmt.2019.2945016

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