Piezoelectric Ceramics and Flexible Printed Circuits’ Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly

Published 2019 View Full Article

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Title
Piezoelectric Ceramics and Flexible Printed Circuits’ Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly
Authors
Keywords
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Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 9, Issue 9, Pages 1897-1903
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2019-03-29
DOI
10.1109/tcpmt.2019.2907927

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