Processing and Characterization of Extremely Hard and Strong Cu-(0-15 wt pct)Al Alloys
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Title
Processing and Characterization of Extremely Hard and Strong Cu-(0-15 wt pct)Al Alloys
Authors
Keywords
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Journal
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2019-11-27
DOI
10.1007/s11661-019-05545-x
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- (2012) Haiming Wen et al. SCRIPTA MATERIALIA
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