Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density

Published 2008 View Full Article

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Title
Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density
Authors
Keywords
-
Journal
APPLIED PHYSICS LETTERS
Volume 92, Issue 8, Pages 081903
Publisher
AIP Publishing
Online
2008-02-26
DOI
10.1063/1.2870014

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