Ni and Cu recovery by bioleaching from the printed circuit boards of mobile phones in non-conventional medium

Published 2019 View Full Article

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Title
Ni and Cu recovery by bioleaching from the printed circuit boards of mobile phones in non-conventional medium
Authors
Keywords
-
Journal
JOURNAL OF ENVIRONMENTAL MANAGEMENT
Volume 250, Issue -, Pages 109502
Publisher
Elsevier BV
Online
2019-09-07
DOI
10.1016/j.jenvman.2019.109502

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