Ni and Cu recovery by bioleaching from the printed circuit boards of mobile phones in non-conventional medium

标题
Ni and Cu recovery by bioleaching from the printed circuit boards of mobile phones in non-conventional medium
作者
关键词
-
出版物
JOURNAL OF ENVIRONMENTAL MANAGEMENT
Volume 250, Issue -, Pages 109502
出版商
Elsevier BV
发表日期
2019-09-07
DOI
10.1016/j.jenvman.2019.109502

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