Copper nanoparticles promote rapid wound healing in acute full thickness defect via acceleration of skin cell migration, proliferation, and neovascularization

Title
Copper nanoparticles promote rapid wound healing in acute full thickness defect via acceleration of skin cell migration, proliferation, and neovascularization
Authors
Keywords
-
Journal
Publisher
Elsevier BV
Online
2019-08-08
DOI
10.1016/j.bbrc.2019.07.110

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