Copper nanoparticles promote rapid wound healing in acute full thickness defect via acceleration of skin cell migration, proliferation, and neovascularization

标题
Copper nanoparticles promote rapid wound healing in acute full thickness defect via acceleration of skin cell migration, proliferation, and neovascularization
作者
关键词
-
出版物
出版商
Elsevier BV
发表日期
2019-08-08
DOI
10.1016/j.bbrc.2019.07.110

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