A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins

Published 2019 View Full Article

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Title
A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins
Authors
Keywords
Epoxy resins, Imidazole-copper (II) complex, Latent curing agent
Journal
POLYMER
Volume 178, Issue -, Pages 121586
Publisher
Elsevier BV
Online
2019-06-15
DOI
10.1016/j.polymer.2019.121586

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