A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins

标题
A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins
作者
关键词
Epoxy resins, Imidazole-copper (II) complex, Latent curing agent
出版物
POLYMER
Volume 178, Issue -, Pages 121586
出版商
Elsevier BV
发表日期
2019-06-15
DOI
10.1016/j.polymer.2019.121586

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started