Journal
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
Volume 66, Issue 9, Pages 7326-7337Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TIE.2018.2879306
Keywords
Application-specific integrated circuit (ASIC); EC testing (ECT); eddy currents (ECs); high resolution; low-noise; nondestructive test (NDT); thin film sensors; tunnel magnetoresistive (MR) sensors; variable-gain amplifier (VGA)
Categories
Funding
- FCT, Fundacao para a Ciencia e a Tecnologia (Portugal) [UID/CEC/50021/2013, UID/NAN/50024/2013, NORTE-01-0145-FEDER-022090, MagScopy4IHC - PTDC/EMD-TLM/31200/2017, PTDC/EEI-EEE/31416/2017, PD/BD/128208/2016, SFRH/BPD/116007/2016, SFRH/BD/111538/2015]
- Fundação para a Ciência e a Tecnologia [PD/BD/128208/2016, SFRH/BPD/116007/2016, PTDC/EEI-EEE/31416/2017, SFRH/BD/111538/2015] Funding Source: FCT
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This paper discloses two high-sensitivity probes for Eddy Current Nondestructive Test (NDT) of buried and surface defects. These probes incorporate eight and 32 magnetoresistive sensors, respectively, which are optimized for high sensitivity and spatial resolution. The signal processing and interfacing are carried out by a full-custom application-specific integrated circuit (ASIC). The ASIC signal chain performs with a thermal input-referred noise of 30 nV/root Hz at 1 kHz, with 66 mW of power consumption, in a die with 3.7 x 3.4 mm(2). NDT results are presented, showing that there is an increase in spatial resolution of surface defects when contrasted to prior art, enabling the probes to resolve defects with diameters of 0.44 mm, pitches of 0.6 mm, and minimum edge distance as low as 0.16 mm. The results also show that the probe for buried defects is a good all-round tool for detection of defects under cladding and multiple-plate flat junctions.
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