The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy

Published 2015 View Full Article

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Title
The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy
Authors
Keywords
Sn–Ag–Cu solder, Bi and Fe additives, Microstructural properties, Mechanical properties, Thermal properties
Journal
MICROELECTRONICS RELIABILITY
Volume 55, Issue 9-10, Pages 1886-1890
Publisher
Elsevier BV
Online
2015-07-11
DOI
10.1016/j.microrel.2015.06.134

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