Highly efficient planarization of sliced 4H–SiC (0001) wafer by slurryless electrochemical mechanical polishing

Published 2019 View Full Article

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Title
Highly efficient planarization of sliced 4H–SiC (0001) wafer by slurryless electrochemical mechanical polishing
Authors
Keywords
Silicon carbide, Slurryless, Electrochemical mechanical polishing
Journal
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
Volume -, Issue -, Pages 103431
Publisher
Elsevier BV
Online
2019-07-06
DOI
10.1016/j.ijmachtools.2019.103431

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