Highly efficient planarization of sliced 4H–SiC (0001) wafer by slurryless electrochemical mechanical polishing

标题
Highly efficient planarization of sliced 4H–SiC (0001) wafer by slurryless electrochemical mechanical polishing
作者
关键词
Silicon carbide, Slurryless, Electrochemical mechanical polishing
出版物
出版商
Elsevier BV
发表日期
2019-07-06
DOI
10.1016/j.ijmachtools.2019.103431

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