Thermal stability of amorphous tungsten/tungsten nitride synthesis using HFCVD as a diffusion barrier for copper

Effect of thin Mo2C layer on thermal stability of Si/SiO2/Ti/Cu system

(2012) C. C. Tripathi et al.   BULLETIN OF MATERIALS SCIENCE

Chemical Vapor Deposition of Cobalt Nitride and its Application as an Adhesion-Enhancing Layer for Advanced Copper Interconnects

(2012) Harish B. Bhandari et al.   ECS Journal of Solid State Science and Technology

Approximation of crystallite size and microstrain via XRD line broadening analysis in TiSiN thin films

(2011) A.R. Bushroa et al.   VACUUM

Diffusion barrier performance of amorphous W–Ti–N films in Cu metallization

(2010) Wang Qingxiang et al.   VACUUM

Diffusion barrier properties of amorphous and nanocrystalline Ta films for Cu interconnects

(2009) Z. H. Cao et al.   JOURNAL OF APPLIED PHYSICS

Deposition of WNxCy thin films for diffusion barrier application using the dimethylhydrazido (2−) tungsten complex (CH3CN)Cl4W(NNMe2)

(2009) Hiral M. Ajmera et al.   THIN SOLID FILMS

The effects of surface roughness and nanostructure on the properties of indium tin oxide (ITO) designated for novel optoelectronic devices fabrication

(2008) G. Kavei et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY