Enhancing Interconnect Reliability and Performance by Converting Tantalum to 2D Layered Tantalum Sulfide at Low Temperature

Large-Area, Single-Layer Molybdenum Disulfide Synthesized at BEOL Compatible Temperature as Cu Diffusion Barrier

(2018) Chun-Li Lo et al.   IEEE ELECTRON DEVICE LETTERS

Versatile technique for assessing thickness of 2D layered materials by XPS

(2018) Dmitry Y Zemlyanov et al.   NANOTECHNOLOGY

Two-dimensional tantalum disulfide: controlling structure and properties via synthesis

(2018) Rui Zhao et al.   2D Materials

Sulfidation of 2D transition metals (Mo, W, Re, Nb, Ta): thermodynamics, processing, and characterization

(2017) Hamed Simchi et al.   JOURNAL OF MATERIALS SCIENCE

Transfer-free multi-layer graphene as a diffusion barrier

(2017) R. Mehta et al.   Nanoscale

Two-dimensional metallic tantalum disulfide as a hydrogen evolution catalyst

(2017) Jianping Shi et al.   Nature Communications

Vertical and Lateral Copper Transport through Graphene Layers

(2015) Ling Li et al.   ACS Nano

Low-Temperature Synthesis of Large-Scale Molybdenum Disulfide Thin Films Directly on a Plastic Substrate Using Plasma-Enhanced Chemical Vapor Deposition

(2015) Chisung Ahn et al.   ADVANCED MATERIALS

Ultrathin graphene and graphene oxide layers as a diffusion barrier for advanced Cu metallization

(2015) Jae Hoon Bong et al.   APPLIED PHYSICS LETTERS

Comparison of graphene growth on arbitrary non-catalytic substrates using low-temperature PECVD

(2015) Sunny Chugh et al.   CARBON

Enhanced Electrical and Thermal Conduction in Graphene-Encapsulated Copper Nanowires

(2015) Ruchit Mehta et al.   NANO LETTERS

Mass Transport Mechanism of Cu Species at the Metal/Dielectric Interfaces with a Graphene Barrier

(2014) Yuda Zhao et al.   ACS Nano

1-nm-thick graphene tri-layer as the ultimate copper diffusion barrier

(2014) Ba-Son Nguyen et al.   APPLIED PHYSICS LETTERS

Graphene as an atomically thin barrier to Cu diffusion into Si

(2014) Juree Hong et al.   Nanoscale

Dislocations and Grain Boundaries in Two-Dimensional Boron Nitride

(2012) Yuanyue Liu et al.   ACS Nano

Time dependent dielectric breakdown physics – Models revisited

(2012) J.W. McPherson   MICROELECTRONICS RELIABILITY

Predicting Dislocations and Grain Boundaries in Two-Dimensional Metal-Disulfides from the First Principles

(2012) Xiaolong Zou et al.   NANO LETTERS

Resistivity dominated by surface scattering in sub-50 nm Cu wires

(2010) R. L. Graham et al.   APPLIED PHYSICS LETTERS

Cones, Pringles, and Grain Boundary Landscapes in Graphene Topology

(2010) Yuanyue Liu et al.   NANO LETTERS

Resistivity of thin Cu films coated with Ta, Ti, Ru, Al, and Pd barrier layers from first principles

(2010) Ferdows Zahid et al.   PHYSICAL REVIEW B

Copper diffusion in TaN-based thin layers

(2008) J. Nazon et al.   APPLIED SURFACE SCIENCE