Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) Nanoparticles/Cu Low-Ag Solder Joints
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Title
Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) Nanoparticles/Cu Low-Ag Solder Joints
Authors
Keywords
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Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2019-05-03
DOI
10.1007/s11664-019-07211-9
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