Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices

出版年份 2019 全文链接

标题

作者

关键词

Ultra-thin vapour chamber, Vapour-liquid channel separation, Mesh wick, Cooling module, Thermal performance, Heat dissipation

出版物

Volume 187, Issue -, Pages 221-231

出版商

Elsevier BV

发表日期

2019-03-20

DOI

10.1016/j.enconman.2019.03.038

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