Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

Properties of various plasma surface treatments for low-temperature Au–Au bonding

(2018) Michitaka Yamamoto et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Room-temperature bonding of single-crystal diamond and Si using Au/Au atomic diffusion bonding in atmospheric air

(2018) Takashi Matsumae et al.   MICROELECTRONIC ENGINEERING

Surface activated bonding of Ti/Au and Ti/Pt/Au films after vacuum annealing for MEMS packaging

(2018) Takashi Matsumae et al.   MICROELECTRONIC ENGINEERING

Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method

(2017) Eiji HIGURASHI et al.   IEICE TRANSACTIONS ON ELECTRONICS

Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method

(2017) Eiji HIGURASHI et al.   IEICE TRANSACTIONS ON ELECTRONICS

Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

(2016) Muhammad Salman Al Farisi et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Room-temperature wafer scale bonding using smoothed Au seal ring surfaces for hermetic sealing

(2015) Yuichi Kurashima et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application

(2015) Hui Yuen Peng et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Measurement of bonding energy in an anhydrous nitrogen atmosphere and its application to silicon direct bonding technology

(2012) F. Fournel et al.   JOURNAL OF APPLIED PHYSICS

Tailoring the Wetting Properties of Surface-Modified Nanostructured Gold Films

(2011) Jianzhong Zhu et al.   Journal of Physical Chemistry C

Effects of Excimer Irradiation Treatment on Thermocompression Au–Au Bonding

(2010) Naoko Unami et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Evaluation of Oxygen Plasma and UV Ozone Methods for Cleaning of Occluded Areas in MEMS Devices

(2010) D. Adam Hook et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Low-temperature Au–Si wafer bonding

(2010) Errong Jing et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Hybrid integration of GaAs quantum cascade lasers with Si substrates by thermocompression bonding

(2008) D. Andrijasevic et al.   APPLIED PHYSICS LETTERS