The numerical manifold method for crack modeling of two-dimensional functionally graded materials under thermal shocks

Title
The numerical manifold method for crack modeling of two-dimensional functionally graded materials under thermal shocks
Authors
Keywords
Numerical manifold method, Functionally graded materials, Thermal shock crack, Transient temperature, Thermal stress intensity factors
Journal
ENGINEERING FRACTURE MECHANICS
Volume 208, Issue -, Pages 90-106
Publisher
Elsevier BV
Online
2019-01-06
DOI
10.1016/j.engfracmech.2019.01.002

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