The numerical manifold method for crack modeling of two-dimensional functionally graded materials under thermal shocks

出版年份 2019 全文链接

标题

作者

关键词

Numerical manifold method, Functionally graded materials, Thermal shock crack, Transient temperature, Thermal stress intensity factors

出版物

ENGINEERING FRACTURE MECHANICS

Volume 208, Issue -, Pages 90-106

出版商

Elsevier BV

发表日期

2019-01-06

DOI

10.1016/j.engfracmech.2019.01.002

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