Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale

出版年份 2018 全文链接

标题

作者

关键词

SiC, Coupling effect, Deformation, Molecular dynamics

出版物

Volume 45, Issue 2, Pages 2483-2491

出版商

Elsevier BV

发表日期

2018-10-21

DOI

10.1016/j.ceramint.2018.10.175

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