Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments

Title
Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments
Authors
Keywords
Thermoelectric cooling, Electronic heat removal, Thermo-physical parameters, Analytical solutions, Evaluation index for cooling performance
Journal
APPLIED THERMAL ENGINEERING
Volume 148, Issue -, Pages 238-255
Publisher
Elsevier BV
Online
2018-11-13
DOI
10.1016/j.applthermaleng.2018.11.014

Ask authors/readers for more resources

Reprint

Contact the author

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started