Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments

出版年份 2018 全文链接

标题

作者

关键词

Thermoelectric cooling, Electronic heat removal, Thermo-physical parameters, Analytical solutions, Evaluation index for cooling performance

出版物

Volume 148, Issue -, Pages 238-255

出版商

Elsevier BV

发表日期

2018-11-13

DOI

10.1016/j.applthermaleng.2018.11.014

联系作者

Explore over 38,000 international journals covering a vast array of academic fields.

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now