The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy

Published 2018 View Full Article

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Title
The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy
Authors
Keywords
Nickel-tungsten, Hall-Petch effect, Electrodeposition, Nanocrystalline metal, Nickel alloys
Journal
SURFACE & COATINGS TECHNOLOGY
Volume 357, Issue -, Pages 23-27
Publisher
Elsevier BV
Online
2018-10-03
DOI
10.1016/j.surfcoat.2018.09.086

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