Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy

Title
Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy
Authors
Keywords
Au/Pd, Au/Pd/Au, 3D computed tomography, Bump voids
Journal
SURFACE & COATINGS TECHNOLOGY
Volume 358, Issue -, Pages 753-761
Publisher
Elsevier BV
Online
2018-11-28
DOI
10.1016/j.surfcoat.2018.11.085

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