Wafer level packaging of MEMS

Published 2008 View Full Article

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Title
Wafer level packaging of MEMS
Authors
Keywords
-
Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 18, Issue 7, Pages 073001
Publisher
IOP Publishing
Online
2008-05-30
DOI
10.1088/0960-1317/18/7/073001

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