Smart Hybrid Polymers for Advanced Damascene Electroplating: Combination of Superfill and Leveling Properties

High-Resolution Chemical Depth Profiling of Solid Material Using a Miniature Laser Ablation/Ionization Mass Spectrometer

(2015) Valentine Grimaudo et al.   ANALYTICAL CHEMISTRY

Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM

(2013) T. M. T. Huynh et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating

(2012) Nguyen T.M. Hai et al.   ELECTROCHIMICA ACTA

Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating

(2012) N.T.M. Hai et al.   ELECTROCHIMICA ACTA

On the role of halides and thiols in additive-assisted copper electroplating

(2012) Thi M.T. Huynh et al.   ELECTROCHIMICA ACTA

Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives

(2012) Nguyen T. M. Hai et al.   Journal of Physical Chemistry C

Classification of suppressor additives based on synergistic and antagonistic ensemble effects

(2011) P. Broekmann et al.   ELECTROCHIMICA ACTA

Predictive Analytical Fill Model of Interconnect Metallization Providing Optimal Additives Concentrations

(2011) James Adolf et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Mechanistic Analysis of the “Bottom-Up” Fill in Copper Interconnect Metallization

(2009) Rohan Akolkar et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

(2008) O. Lühn et al.   ELECTROCHIMICA ACTA