Mechanistic Analysis of the “Bottom-Up” Fill in Copper Interconnect Metallization

Published 2009 View Full Article

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Title
Mechanistic Analysis of the “Bottom-Up” Fill in Copper Interconnect Metallization
Authors
Keywords
-
Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 156, Issue 9, Pages D351
Publisher
The Electrochemical Society
Online
2009-07-25
DOI
10.1149/1.3156640

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