A new polymer with low dielectric constant based on trifluoromethyl-substituted arene: preparation and properties

A new polymer with low dielectric constant is reported here. This polymer contains a trifluoromethyl-substituted phenyl unit and a binaphthyl unit, and shows high thermostability with a glass transition temperature of 244 degrees C and a 5 wt% loss at temperature 518 degrees C under nitrogen. The polymer also exhibits good film-forming ability, and the formed films exhibit high hydrophobicity with a contact angle of 103.6 degrees with water. In a range of frequencies from 1 to 25 MHz, the polymer reveals an average dielectric constants of about 2.56. In regard to the mechanical properties, the polymer film shows an average hardness of 0.37 GPa and a Young's modulus of 15.07 GPa. These results indicate that the polymer could be used as a varnish for enameled wire, sizing agents for high-performance carbon fiber, and the matrix resin for the production of laminated composites utilized in the printed-circuit-board (PCB) industry.