Extremely anisotropic single-crystal growth in nanotwinned copper

Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures

(2013) Qingqian Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

(2012) H.-Y. Hsiao et al.   SCIENCE

How Grain Growth Stops: A Mechanism for Grain-Growth Stagnation in Pure Materials

(2010) E. A. Holm et al.   SCIENCE

In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

(2009) Di Xu et al.   JOURNAL OF APPLIED PHYSICS

EBSD characterization of twinned copper using pulsed electrodeposition

(2009) Guan-Tai Lui et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Experimental Observations of Stress-Driven Grain Boundary Migration

(2009) T. J. Rupert et al.   SCIENCE