Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules

Title
Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules
Authors
Keywords
-
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2013-10-19
DOI
10.1109/tcpmt.2013.2271651

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