Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks

Authors

Keywords

Journal

Volume 4, Issue 7, Pages 1245-1250

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Online

2014-06-20

DOI

10.1109/tcpmt.2014.2322907

References

View 4 related references

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started