Analysis and Modeling of DC Current Crowding for TSV-Based 3-D Connections and Power Integrity

Power Delivery for 3-D Chip Stacks: Physical Modeling and Design Implication

(2012) Gang Huang et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Distributed TSV Topology for 3-D Power-Supply Networks

(2011) Michael B. Healy et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Electromigration for microarchitects

(2010) Jaume Abella et al.   ACM COMPUTING SURVEYS

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

(2010) Nauman H. Khan et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Electromigration in flip chip solder joints under extra high current density

(2010) Y. W. Lin et al.   JOURNAL OF APPLIED PHYSICS

Electromigration performance of Through Silicon Via (TSV) – A modeling approach

(2010) Y.C. Tan et al.   MICROELECTRONICS RELIABILITY