Thermal Management Challenges in Telecommunication Systems and Data Centers
Published 2012 View Full Article
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Title
Thermal Management Challenges in Telecommunication Systems and Data Centers
Authors
Keywords
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Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 2, Issue 8, Pages 1307-1316
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2012-03-05
DOI
10.1109/tcpmt.2012.2185797
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