Article
Chemistry, Physical
Heng Cui, Quan Zhang, Yiwen Bo, Peijia Bai, Mengyan Wang, Chunyang Zhang, Xiaoshi Qian, Rujun Ma
Summary: The microfluidic cooling system is a promising solution for chip-scale thermal management. However, there is currently no existing electrocaloric cooling device that offers continuous sub-ambient liquid media. In this study, a self-standing flexible electrocaloric capillary tube was fabricated, achieving the highest specific device cooling power density among all reported electrocaloric devices.
Article
Engineering, Electrical & Electronic
Mohsen Packnezhad, Pouria Talebi, Hosein Farzanehfard
Summary: This paper presents a fully soft switched high step-up/down bidirectional converter. The high voltage conversion ratio is achieved using coupled inductors and a switched capacitor, while all active switches operate with zero voltage switching. Active clamp circuits are used in both operating modes to provide soft switching condition for the main switches and absorb the leakage inductance energy. The proposed converter eliminates the reverse recovery problem by using active switches body diodes that turn off at zero current switching (ZCS), and reduces the voltage stress of the main switches compared to the basic bidirectional buck/boost converter.
IET POWER ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Fred C. Lee, Shuo Wang, Qiang Li
Summary: With advancements in technology, power electronics products are increasingly focusing on high efficiency, high power density, and low cost, while the demand for customization is also growing. Although integrated solutions can improve product performance in certain areas, challenges remain in achieving widespread applications. As new technologies are applied, the design paradigm is shifting.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2021)
Article
Thermodynamics
M. Mosavati, R. Barron, R. Balachandar
Summary: In this computational study, the performance of self-oscillating jets for cooling applications is investigated. The flow behavior and heat transfer characteristics of self-oscillating jets are numerically simulated and compared with wall jets and channel flows. Different arrangements of heated devices are also evaluated. The results show that self-oscillating jets provide enhanced heat transfer for devices located away from the central region, while wall jets improve heat transfer around the central region. Channel flow exhibits the lowest heat transfer performance in terms of Nusselt number.
THERMAL SCIENCE AND ENGINEERING PROGRESS
(2023)
Review
Engineering, Environmental
Junwei Liu, Yunfei Zhang, Shuai Li, Cristian Valenzuela, Shukuan Shi, Chongxu Jiang, Shiqiang Wu, Long Ye, Ling Wang, Zhihua Zhou
Summary: With the increasing concern over global warming and climate change, there is a growing demand for clean cooling technologies. Radiative sky cooling (RSC) has emerged as a promising solution that can dissipate heat without causing pollution or consuming energy. However, the low cooling power has hindered its large-scale application. This article provides a critical review of recent efforts to address this challenge and offers potential avenues for further advancements in RSC technology.
CHEMICAL ENGINEERING JOURNAL
(2023)
Article
Engineering, Electrical & Electronic
Samantha Jones-Jackson, Romina Rodriguez, Ali Emadi
Summary: Effective thermal management of power electronics in electric vehicles is crucial for reliability and increased power density. This article focuses on jet impingement as an advanced cooling technique, discussing its proven thermal performance in high-heat-flux applications and future technology development. Factors such as heat transfer, pressure drop, reliability, and current technical gaps and challenges in jet impingement research in electrified transportation are also highlighted.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2021)
Article
Engineering, Manufacturing
Ahmet Mete Muslu, Vanessa Smet, Yogendra Joshi
Summary: As the transition from Si to SiC power devices rapidly grows, new packaging architectures need to be developed to fully benefit from the desired characteristics of SiC technology. The present study offers a highly integrated package (IP) that combines power delivery and cooling functions, showing improved thermal performance compared to conventional packages. The design challenges associated with near-junction cooling at high power levels are explored, and design modifications are proposed to further reduce thermal resistance while increasing package volume.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
(2022)
Article
Engineering, Electrical & Electronic
Yunjie Gu, Yitong Li, Yue Zhu, Timothy C. Green
Summary: The paper introduces a methodology to address the challenges of dynamic frame alignment and system separation in impedance modeling of ac grids, allowing for impedance-based whole-system modeling of generator-converter composite power systems. By utilizing a frame-dynamics-embedding transformation via an intermediary steady frame, locally defined impedance models for each generator or converter are created without reliance on a global frame, while retaining all frame dynamics. The methodology enables analysis of dynamic interactions between generators and converters in a composite grid, providing insights and potential solutions for unstable oscillations caused by PLL-swing coupling in low-inertia grids.
IEEE TRANSACTIONS ON POWER SYSTEMS
(2021)
Article
Thermodynamics
Limin Qi, Dongli Liu, Xiao Liu, Haiyue Pei, Ding Zhao, Haishan Cao, Min Qiu
Summary: Thermal management is crucial for electronic devices to remain within their temperature limits. Micromachined Joule-Thomson (JT) coolers, which reduce temperature fluctuations, show promise for achieving this. In this study, the cooling power of a micromachined JT cooler was examined using nitrogen. By applying high and low pressures, the cooler successfully cooled from room temperature to 88.5 K in 30 minutes. The study introduces a general method for evaluating the cooling performance and discusses the relationship between performance and heat load.
APPLIED THERMAL ENGINEERING
(2023)
Review
Chemistry, Physical
Yuan Meng, Junhong Pu, Qibing Peitz
Summary: Electrocaloric cooling technology has gained attention as an environmentally friendly and efficient alternative in the cooling community. However, the limited adiabatic temperature change of materials poses a challenge. Recent efforts have focused on designing electrocaloric cooling devices based on active heat regeneration and cascading approaches, showing promising results.
Article
Engineering, Electrical & Electronic
Spyros Chatzivasileiadis, Petros Aristidou, Ioannis Dassios, Tomislav Dragicevic, Daniel Gebbran, Federico Milano, Claudia Rahmann, Deepak Ramasubramanian
Summary: This paper collects the challenges and opportunities arising from millions of controllable devices deployed in power systems. The shift towards converter-interfaced resources brings both threats and opportunities, with new dynamic phenomena and instability on one hand, and decentralized response to disturbances on the other. The goal is to tap into the flexibility potential of these devices for safe power system operation, but it requires addressing modeling and control challenges. This paper identifies and describes these challenges.
ELECTRIC POWER SYSTEMS RESEARCH
(2023)
Article
Computer Science, Information Systems
Sebastian Baba, Wojciech Gajewski, Marek Jasinski, Marcin Zelechowski, Marian P. Kazmierkowski
Summary: The paper introduces how important products of the 21st century are manufactured using plasma processing techniques, evaluates common types of power converters within the scope of plasma processing applications, and discusses the key requirements and future challenges for such power supplies.
Article
Energy & Fuels
Dima Bykhovsky
Summary: This paper addresses the modeling of harmonics power in switched-mode power supplies (SMPSs) and proposes a lognormal distribution for time-domain uncorrelation and a Gaussian radial basis function for spectral-domain correlation. A random simulation approach based on the modeling results is also proposed.
Article
Engineering, Electrical & Electronic
Yuhang Yang, Linke Zhou, Omar Zayed, Maryam Alizadeh, Doris Stevanovic, Mehdi Narimani, Ali Emadi
Summary: This article proposes a methodology for analytical modeling and optimization of power modules, focusing on modules with silver-sintered molybdenum (SSM) packaging or other insulated metal substrate types of packaging schemes. The article presents a decoupled Fourier-based thermal model and a stray inductance (L-s) model, both of which show good accuracy when tested with example modules. The models are then used with the particle swarm optimization algorithm to design a half-bridge power module with SSM packaging, and the accuracy of the models is further validated through simulations and tests.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Zbigniew Lisik, Ewa Raj, Krzysztof Zymmer, Henryk Swiatek
Summary: This article presents a new power diode DBW3-3500 encapsulated in a novel press-pack package with a microchannel cooling system. Field tests comparing conventional diodes with single and double-sided water heat sinks and the new diodes with an embedded cooler were conducted and discussed. The measurements showed that even with single-side cooling, the new package reduced the junction temperature by about 40 degrees Celsius compared to conventional liquid cold plates, resulting in improved electrical parameters. The predicted rated forward current reaches 5000 A. Furthermore, the novel solution also offers a reduction in weight and dimensions of the whole system.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
