Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material

Published 2007 View Full Article

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Title
Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material
Authors
Keywords
-
Journal
SURFACE & COATINGS TECHNOLOGY
Volume 202, Issue 12, Pages 2540-2544
Publisher
Elsevier BV
Online
2007-09-22
DOI
10.1016/j.surfcoat.2007.09.019

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