HRTEM and X-ray diffraction analysis of Au wire bonding interface in microelectronics packaging

Published 2010 View Full Article

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Title
HRTEM and X-ray diffraction analysis of Au wire bonding interface in microelectronics packaging
Authors
Keywords
-
Journal
SOLID STATE SCIENCES
Volume 13, Issue 1, Pages 72-76
Publisher
Elsevier BV
Online
2010-11-03
DOI
10.1016/j.solidstatesciences.2010.10.011

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