HRTEM and X-ray diffraction analysis of Au wire bonding interface in microelectronics packaging

标题
HRTEM and X-ray diffraction analysis of Au wire bonding interface in microelectronics packaging
作者
关键词
-
出版物
SOLID STATE SCIENCES
Volume 13, Issue 1, Pages 72-76
出版商
Elsevier BV
发表日期
2010-11-03
DOI
10.1016/j.solidstatesciences.2010.10.011

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