Highly sensitive wafer-level packaged MEMS magnetic field sensor based on magnetoelectric composites

Published 2012 View Full Article

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Title
Highly sensitive wafer-level packaged MEMS magnetic field sensor based on magnetoelectric composites
Authors
Keywords
-
Journal
SENSORS AND ACTUATORS A-PHYSICAL
Volume 189, Issue -, Pages 321-327
Publisher
Elsevier BV
Online
2012-10-23
DOI
10.1016/j.sna.2012.10.015

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