Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen
Published 2014 View Full Article
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Title
Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen
Authors
Keywords
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Journal
PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES
Volume 470, Issue 2172, Pages 20140609-20140609
Publisher
The Royal Society
Online
2014-10-22
DOI
10.1098/rspa.2014.0609
References
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